| Attribute |
Standard |
Advanced |
Future |
| Minimum Outer Layer Line |
0.005 |
0.003 |
0.002 |
| Minimum Outer Layer
Space |
0.005 |
0.003 |
0.002 |
| Minimum Inner Layer Line |
0.005 |
0.003 |
0.002 |
| Minimum Inner Layer
Space |
0.005 |
0.003 |
0.002 |
| Layer Count |
14 |
18 |
No Limit |
| Layer to Layer Registration Tolerance |
+/- .005 |
+/- .004 |
<+/- .003 |
| Minimum Finished Thickness |
0.02 |
0.01 |
0.008 |
| Maximum Finished Thickness |
0.125 |
0.25 |
0.3 |
| Maximum Finished
Thickness Tolerance |
10% |
8% |
6% |
| Minimum Dialectric
Thickness |
0.0035 |
0.002 |
0.0015 |
| Minimum Impedance
Tolerance |
+/- 10% |
+/- 5% |
|
| Maximum Warpage (inch per
inch) |
0.007 |
0.006 |
0.005 |
| Minimum Plated Hole Size-Finished |
0.01 |
0.006 |
0.004 |
| Hole Location Tolerance |
+/- .003 |
+/- .002 |
+/- .002 |
| Maximum Aspect Ratio |
10:01 |
12:01 |
15:01 |
| Minimum Plane Relief Over Finished Hole |
0.024 |
0.020 |
0.018 |
| Minimum Inner Pad Size Over Finished Hole |
0.012 |
0.01 |
0.008 |
| Minimum Outer Pad Size Over Finished Hole |
0.012 |
0.01 |
0.008 |
| Plated Hole Tolerance |
+/- .003 |
+/- .002 |
+.001-.002 |
| Minimum Solder Mask Web |
0.005 |
0.003 |
0.002 |
| Profiling Tolerances |
+/- .005 |
+/- .003 |
+/- .002 |
| Minimum Feature Pitch-Grid Test |
0.02 |
0.016 |
0.01 |
| Minimum Feature Pitch-Flying Probe |
0.015 |
0.01 |
0.008 |
| Minimum Silkscreen Width |
0.008 |
0.006 |
0.004 |
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| Material Type |
Max Operating Temp |
Dielectric Constant |
| Isola FR404 |
140C |
4.7 |
| Isola FR406 |
160C |
4.6 |
| Isola FR408 |
170C |
3.8 |
| Polyimide |
250C |
4.4 |
| BT Epoxy |
170C |
4.1 |
| Rogers 4003 |
270C |
3.38 |
| Rogers 4350 |
270C |
3.48 |
| Buried Capacitance |
160C |
3.0-4.4 |
| Arlon Laminates |
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| Surface Finish Type |
| Solder Level |
| Electroless Nickel-Immersion Gold |
| Immersion Silver |
| Entek 106A |
| Immersion Tin |
| Carbon Ink |
| Electrolytic Hard Gold |
| Electrolytic Soft Gold |
| Selective Hard Gold |
| Selective Solder |
| Copper oz Max Out/In 6oz/6oz |